Through-hole-plating

Because it's an impossible and expensive job, to apply through-hole-plating the chemical way on 2-layer prototypes and small series, we have chosen the mechanical way. Holes that can not be soldered easily on the component side, will be filled with a brass cylinder (revit). We apply this on hole sizes of 0.8 and 1.0 mm only.

On larger holes, the connection can be made another way. We drill a small hole on the edge of a pad through which you can put a a piece of wire. Then you can solder on both sides of the PCB.